A Digital Platform to Automate Diamond Polishing
New technologies are changing the way diamonds are being cut and polished. A combination of hardware and software now enables seamless manufacturing, reducing “mine to market” timelines across the diamond pipeline.
Elevating Employee Experience With Leisure Areas
Mark your calendars for September 18-23 and visit our booth at EMO in Hannover to see innovation in action!
We will be showcasing our high-precision LCS 305 laser machining center with water jet guided laser technology for demanding 5-axis machining tasks.
Our team of experts looks forward to talking with you and exploring how our advanced solutions can be integrated into your manufacturing processes.
See you at EMO, booth B58 in Hall 11!
Synova is delighted to be the Silver Sponsor at the inaugural Lab-Grown Diamond Symposium in Dubai, UAE on 10 July 2023.
Hosted under the theme ‘Building lab-grown diamonds’ own bright future’, the LGD Symposium 2023 will bring together industry experts and stakeholders to share knowledge and discuss key industry issues in an interactive format to jointly lay the groundwork for sustainable growth and success of the LGD industry.
We invite all attendees to visit our booth in the vestibule area of the symposium at Atlantis, The Palm (Ballroom C & D) and explore the cutting-edge solutions that Synova brings to the lab-grown diamond industry.
>> Visit the LGD Symposium website
Synova Joins EPIC: Advancing Photonics Together
We are excited to announce that Synova has become a member of EPIC, the leading industry association promoting sustainable development in photonics in Europe. This partnership allows us to connect with a dynamic photonics ecosystem fostering technological advancements. We look forward to leveraging this collaboration to drive innovation and growth in our field.
At the Forefront of a New Era in Diamond Cutting
With new projects and enthusiasm into 2021
How wet laser technology can improve your results
Grand Opening of new Synova US headquarters
LDS (Laser Dicing Systems)
LDS 300 M
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
LDGS 300 A
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.