Season's Greetings and a Happy Year 2023
How Diamonds de Canada Reinvented Diamond Cutting
Benjamin King of Diamonds de Canada is helping tell the origin story and journey of natural diamonds. When diamonds were discovered nearly 4,000 years ago, humans had yet to come across something they could not cut, bend, or shape to their will.
By Grant Mobley
Thin as Film
In the world of metals fabricating, proces- sing thin materials can pose a challenge – with heat input being one of the main assailants to material composition and integrity. Medical component manufacturers that produce stainless steel stents know this challenge well.
By Abbe Miller
Synova célèbre ses 25 ans de développement
Il y a 25 ans, Bernold Richerzhagen, le fondateur de Synova, a réalisé sa vision de combiner la lumière et l'eau pour développer une méthode hybride d'usinage au laser supérieure aux technologies existantes.
By Nitin Shankar
Synova Celebrates 25 Years of Development
Twenty-five years ago, Bernold Richerzhagen, Synova’s founder, realized his vision of combining light and water to develop a hybrid method of laser machining superior to existing technologies.
By Nitin Shankar
On the Threshold of Radical Change
On the supply side, 15 countries on the African continent now provide 50% of global diamonds. The five largest African mining countries (Angola, Botswana, Namibia, South Africa and Zimbabwe) recover over 35 million carats of diamonds from their mines.
Migliorare il taglio laser con un getto d’acqua
La soluzione Laser MicroJet prevede l'unione di due tecnologie e consente di lavorare un'ampia gamma di materiali e spessori con altissima precisione.
By Marco Basso
LDS (Laser Dicing Systems)
LDS 300 M
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
LDGS 300 A
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.