Synova joins EPIC
We are excited to announce that Synova has become a member of EPIC, the leading industry association promoting sustainable development in photonics in Europe. This partnership allows us to connect with a dynamic photonics ecosystem fostering technological advancements. We look forward to leveraging this collaboration to drive innovation and growth in our field.
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.
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These machines are ideal for the following industries: