News

Jul 6, 2023

Lab-Grown Diamond Symposium 2023

Synova Silver Sponsor at Lab-Grown Diamond Symposium in Dubai

Synova is delighted to be the Silver Sponsor at the inaugural Lab-Grown Diamond Symposium in Dubai, UAE on 10 July 2023.

Hosted under the theme ‘Building lab-grown diamonds’ own bright future’, the LGD Symposium 2023 will bring together industry experts and stakeholders to share knowledge and discuss key industry issues in an interactive format to jointly lay the groundwork for sustainable growth and success of the LGD industry.

We invite all attendees to visit our booth in the vestibule area of the symposium at Atlantis, The Palm (Ballroom C & D) and explore the cutting-edge solutions that Synova brings to the lab-grown diamond industry.

>> Visit the LGD Symposium website

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.