Schneiden von Diamantwerkzeugen mit Laser MicroJet
Neue Entwicklungen in der wasserstrahl- geführten Laserbearbeitung von industriellen Diamantwerkzeugen. Beim Laser MicroJet System wird ein Laserstrahl nach seinem Durchgang durch eine druckbelastete Wasser- kammer in eine Düse fokussiert.
By Sébastien Kurzen, Nitin Shankar
As carbon fiber-reinforced polymer (CFRP) and ceramic matrix composite (CMC) materials proliferate in aircraft engines, space components and hypersonic applications, machining becomes an issue where precision and efficiency can alter program outcomes.
By Ginger Gardiner
Technology Volume production of high precision tools with new 5-axis LCS 305. Synova’s patented LMJ technology delivers better results than conventional dry lasers and has become a benchmark in the processing of diamond materials.
By Jacques Coderre, Rémi Laure, Amédée Zryd
As fast as laser, as precise as EDM
LMJ guides a laser beam within a hair-thin water jet enabling a long working length. While it remains a thermal technology, the coupling with the water jet enables better local cooling and cleaning. Synova is the pioneer in exploring and commercialising this cool technology.
By Jun Wang and Gerrit Ter Hoek
Drilling of Holes in Ceramic Substrates
Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.
Cutting of High-Precision Metal Parts
Synova's Laser Cutting System (LCS) 800 was used for job shop of high precision parts. In this case, throughput and flexibility increased while quality remained the same as with etching and electroforming.
Shadow Mask Patterning
LMJ is used to cut and drill thin nickel masks, so called shadow mask patterning. Nickel foils are challenging to cut/ablate due to the large size and low thickness.
Cutting of Electrical Components
Synova's Laser MicroJet (LMJ) is used to cut difficult-to-machine metal alloys for electrical components reaching high edge quality and accuracy.
Cutting of Platinum Electrodes
The main challenge to cut platinum electrodes is to reach to the electrode which is welded more than 20mm deep in a cylinder. Processing with LMJ is much faster than with EDM.
High-Tech Components
LMJ, heat damage-free processing high-tech components; medtech, micro-machining.
LDS (Laser Dicing Systems)
LDS 300 M
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
LDGS 300 A
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.