News

Sep 12, 2023

Synova at EMO 2023

Cool and Clean Laser Tech at EMO. Visit Our Booth at EMO 2023!

Mark your calendars for September 18-23 and visit our booth at EMO in Hannover to see innovation in action!

We will be showcasing our high-precision LCS 305 laser machining center with water jet guided laser technology for demanding 5-axis machining tasks.

Our team of experts looks forward to talking with you and exploring how our advanced solutions can be integrated into your manufacturing processes.

See you at EMO, booth B58 in Hall 11!

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.