Drilling of Holes in Ceramic Substrates

Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.

 

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Additional Info

  • Application Areas: Semiconductors & Photovoltaics
  • Material: Metal Deposition , Photolithography
  • Process: Drilling
Read 410 times Last modified onOct 18, 2021