CuBe
| LMJ used for prototyping on CuBe, damage-free cutting and drilling. LMJ has high flexibility for lower production volumes, no deburring needed. |
Shaver Caps
LMJ for prototyping, cutting, drilling of demanding shaver caps. Requirements met: damage-free, vertical, and precise processing.
High-Tech Parts
Laser MicroJet (LMJ) is used for micro-machining of high-tech components for the watch, medtech, space and defense industry. It is the perfect tool for flexible, stable and heat damage-free processes.
Semiconductor Reactor Sub-Assemblies
LMJ is used for micro-machining semiconductor reactor sub-assembly parts with tight tolerances on thick, hard materials in contact with reactive gas.
Cutting of LED Chips
LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes.
Chamfer Cutting
LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.
Cutting of Platinum-Iridium
LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.
Taiko Ring Removal
Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible.
Complementary Metal Oxide
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Silicon frames are very brittle and request a gentle processing technology without any micro cracks and chipping. LMJ reaches high accuracy, straight walls, low roughness and is highly flexible. |
Edge Trimming of CMOS Image Sensors
LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality.
LDS (Laser Dicing Systems)
LDS 300 M
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
LDGS 300 A
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.