Additional Info
- Application Areas: Semiconductors & Photovoltaics
- Material: Platinum-Iridium
- Process: Dicing, Single Die Cutting
Cutting of Platinum-Iridium
LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.
-
font size
decrease font size
increase font size
Published in
Case Studies
Tagged under
