Displaying items by tag: Semiconductors and Photovoltaics

Drilling of via holes in ceramic substrates of thin film circuits with LMJ eliminates the hole-cleaning step and reduces cost of ownership versus CO2 lasers.

LMJ is used for micro-machining semiconductor reactor sub-assembly parts with tight tolerances on thick,  hard materials in contact with reactive gas.

LED chips and packages are made of materials that are frequently difficult to cut mechanically. With LMJ one has high flexibility regarding materials and shapes. 

 LMJ is used to downsize 450mm silicon semiconductor wafers to 300mm and 200mm wafers, without any impact on the material.

LMJ was chosen to dice sensitive platinum-iridium detectors in the form of microchips, it has several advantages over blade sawing.

 Thin wafers are challenging to manipulate and to process due to the high flexibility and fragility. With LMJ the perfect TAIKO ring removal becomes possible. 

LMJ is used to trim edges of CMOS image sensors and proves superiority over EDM by significantly higher quality. 

 LMJ is the perfect choice to cut silicon carbide which is a challenging material to cut because of its hardness and brittleness. In this case it is used for IGTB Power Chips.

LMJ: wafer dicing, device singulation. Elimination of high operational costs for blades.