Displaying items by tag: Cutting of Lab Grown Diamonds

Oct 13, 2021

CVD Seed Slicing

The challenge was to slice large CVD crystals (chemical vapor deposition) of up to 25 mm from a single direction and along the largest thickness, with a high quality.

The LMJ is used for cutting components with free froms with high accuracy requirements (± 5 μm) from CVD crystals.

The use of LMJ ensures a high quality coring and slicing process of CVD crystals and smooth surfaces as well as low roughness what requires minimal post treatments.

With LMJ there was an improvement in yield, straightness, smoothness, cracks, and throughput in coring and slicing CVD crystals.

The goal is to get a maximum number of slices out of the HPHT crystal (high pressure, high temperature) and to cut variable thicknesses ranging up to 12 mm.

The aim is to obtain a maximum number of slices from the CVD crystal. Cutting with a constant parallel kerf and without tapering with LMJ ensures a higher yield.