News

Mikroniek: "As fast as laser, as precise as EDM"

By Jun Wang and Gerrit Ter Hoek

As fast as laser, as precise as EDM

Laser MicroJet® (LMJ) is a hybrid technology that guides a laser beam within a hair-thin water jet enabling a long working length. While it remains a thermal technology, the coupling with the water jet enables better local cooling and cleaning. Swiss company Synova is the pioneer in exploring and commercialising this cool technology. In the Netherlands, Ter Hoek is a service provider exploiting this technology, next to its main expertise in EDM technology, for the high-tech manufacturing industry across Europe and beyond. 

Read the entire article

LDS (Laser Dicing Systems)

LDS 300 M

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LDGS 300 A

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

Are you interested in a demo or feasibility test?

Call now +41 21 55 22 600

or Contact us »

Typical Applications

These machines are ideal for the following industries: