Laser Gets Wet
Just add water. According to a report recently published by General Electric, that’s the ticket to making laser machining a viable process for producing the cooling holes that pepper the surfaces of turbine blades for both gas and industrial applications.
By Matt Danford
All Synova Systems
Turnkey Systems
Synova’s state-of-the-art laser cutting machines are available in manual, semi-automatic or fully automatic versions. These high-precision cutting systems, featuring our proprietary Laser MicroJet® technology, perform fast, accurate, omni-directional cutting with no chipping, burrs, deposition, contamination, thermal damage, material changes or mechanical stress.
Our tools have been repeatedly field proven and are used for 24-hour-a-day industrial production.
Synova currently offers several types of water jet guided laser cutting machines:
LDGS 300 A
The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.
LDS 300 M
The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.
Jobs & Careers
If your skills and experience match our profile and you wish to join our fast-growing, innovative and progressive high-tech company, should you feel that you have the qualities to make an effective contribution, please send your application (CV, certificates and references) to our HR department.
In return, we offer a team oriented and enthusiastic working environment where people really count. You have every opportunity to learn new skills and develop an interesting career.
Human Resources
SYNOVA is a leading supplier of state-of-the-art laser solutions for the industrial micro-machining, diamond and semiconductor industries. As the world pioneer and leader in water jet guided laser technology, all of Synova’s high-precision laser-processing machines are based on our exclusive, patented technologies. Our overall charter is to focus on customized solutions that meet our customers’ demands by combining the latest laser technology breakthroughs and its unique experience in water jet guided laser beams on highly sensitive materials.
SYNOVA is a privately held company, with a worldwide customer base that spans the globe. The majority of our employees work primarily at our headquarters in Duillier (near Nyon) on the edge of Switzerland’s Lake "Léman" (also called Lake Geneva); however, we also have subsidiaries in the United States, India, Korea and Japan.
We are committed to providing our employees with excellent working conditions, stimulating careers, competitive compensation and a work environment that promotes both teamwork and individual creativity. In return, we expect Synova staff to deliver superior work performance and to be sincerely dedicated to company objectives and activities. As a fast-growing company, we are looking for highly motivated and talented people who have experience in similar industries and are willing to work in a fast paced, international and multicultural environment.
Our Human Resources Department is dedicated to supporting Synova's managers and staff members at every level, facility management on various HR projects, as well as supporting general Human Resources activities. These include developing strategies to solve business needs and implementing sustainable solutions across the facility. Focus areas include human relations, supporting management with excellent knowledge of Swiss labor laws, a strong sense of ethics and change management.
Job vacancies
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