Notice

There was a problem rendering your image gallery. Please make sure that the folder you are using in the Simple Image Gallery Pro plugin tags exists and contains valid image files. The plugin could not locate the folder: media/k2/galleries/124

News

« Back to the list

Apr 11, 2017

New Synova Corporate Headquarters in Duillier

New Corporate Headquarters in Duillier

Synova is excited to announce that it recently moved into larger, more modern premises in Duillier, halfway between Geneva and Lausanne. The new 2300 square meter facility offers extended production capacity and a state-of-the-art application laboratory.

Our application engineers and a total of six Laser MicroJet demo machines are available for feasibility tests, application development and demonstrations. Two machines are entirely dedicated to cutting jobs such as prototypes or small-batch parts.

The building - formerly used by the watch industry - has been entirely renovated and equipped with a new façade. The new premises include a luminous production hall and showroom in the heart of the building as well as generous office space in the adjacent wings. Our new location is close to the city of Nyon in the canton of Vaud, only 20 minutes away from the Geneva airport and easily accessible from the main highway.

Please note our new address and phone number:

SYNOVA S.A.
Route de Genolier 13
1266 Duillier
Switzerland

Phone: +41 21 55 22 600

Email addresses remain unchanged. Feel free to contact us with any questions you may have concerning our new location or services.

We look forward to serving you from our new address!

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.