News

Dec 1, 2016

Duillier HQ

New Company Location as of Dec.12: Synova Is Moving Its Corporate Headquarters to Duillier

In order to expand our production capacity and provide a better service to our customers, Synova will relocate into larger and more modern premises in Duillier mid-December 2016. Our new location is close to the city of Nyon in the canton of Vaud, only 20 minutes away from the Geneva airport and easily accessible from the main highway.

To minimize disruption, we have arranged the move from December 12th to 14th, 2016. We will be fully operational again Thursday, December 15th. We thank you in advance for your understanding and apologize for any inconvenience this change may cause.

Please note our new address as of December 12th:

SYNOVA S.A.
Route de Genolier 13
CH-1266 Duillier
Switzerland

Phone (NEW): +41 21 55 22 600

We kindly ask you to update your records accordingly. Email addresses will remain unchanged. Feel free to contact us with any questions you may have concerning our new location or services.

We look forward to serving you from our new address!

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.