News

Jul 23, 2024

Scott Fosdick Joins Synova as SVP of Sales, Marketing & Customer Service

We are delighted to welcome Scott Fosdick as our new Senior Vice President of Sales, Marketing, and Customer Service.

Scott brings over 30 years of industry experience in mechanical engineering, with a robust background in R&D, service, applications, business development, sales, and marketing. He has held leadership positions with companies such as GF Machining Solutions and Makino.

His expertise will be crucial in driving our strategic initiatives forward, enhancing our market presence, and fostering innovative solutions that meet the evolving needs of our customers.

We are confident that his experience and strategic vision will be a valuable addition to the Synova leadership team!

Read the entire press release here

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.