News

Mar 9, 2022
Unicef Supporter Unicef Supporter

War in Ukraine - Synova supports UNICEF

As the conflict escalates, so do the needs of children and families. Synova contributes to UNICEF Switzerland and Lichtenstein's efforts to establish, amongst others, "Blue Dot Hubs" along key travel corridors to provide crucial support to children and families on the run. The main focus is on information, safe spaces for mothers and children, and the ability to identify unaccompanied children separated from their parents and ensure their protection.

LDS (Laser Dicing Systems)

LDS 300 M

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LDGS 300 A

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

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Typical Applications

These machines are ideal for the following industries: