News

Feb 2, 2022

Synova Platinum Sponsor | DaVinci Live Demos

Synova is proud to be a Platinum Sponsor for the Dubai Diamond Conference (DDC) which will be held on February 21, 2022 in Dubai, UAE.
 
Dr. Bernold Richerzhagen, Synova's founder and CEO, will take part in a DDC panel on technology and re-thinking the diamond supply chain. Together with other industry-leading speakers he will discuss the future of the diamond industry and how technological advances are impacting the midstream.
 
Throughout ‘Dubai Diamond Week’ (Feb. 21-25), Synova will host live demonstrations of its automated laser shaping system for diamonds: DaVinci Diamond Factory. The machine demonstrations will take place all day from 10 a.m. to 6 p.m. at Almas Diamond Services in the Almas Tower (Level 2).
 
Stop by and see firsthand how a rough diamond is turned into a fully shaped round brilliant with 57 facets in just over an hour!
 
Please contact Jörg Pausch, Head of Diamond Business, for more information about the live demos (This email address is being protected from spambots. You need JavaScript enabled to view it.).
 
We look forward to seeing you in Dubai!

LDS (Laser Dicing Systems)

LDS 300 M

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LDGS 300 A

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

Are you interested in a demo or feasibility test?

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Typical Applications

These machines are ideal for the following industries: