News

Nov 5, 2021

Laser Cutting System LCS 800 in the spotlight

The 3-axis laser cutting machine LCS 800 with integrated Laser MicroJet® technology is a robust and versatile system conceived for a multitude of high-precision cutting and drilling applications in different industrial sectors.

The large mounting table allows machining of virtually any part size.

Main applications include machining of semiconductor equipment sub-assemblies, metal masks, and other components made of metal, ceramics, or composites (e.g. silicon carbide, CFRP).

Watch the video and learn more about the precision machine LCS 800 !

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

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LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.