News

May 11, 2021

Unicef Supporter

Emergency situation in India - Synova supports UNICEF

The COVID situation in India is devastating. New cases have surged to another record high.

Synova has decided to support UNICEF Switzerland and Liechtenstein with a donation to help the teams on the ground to maintain medical care and save lives during this new deadly wave of COVID-19 infections. Synova's contribution will help to advance the provision of life-saving oxygen equipment and strengthen the COVID-19 prevention measures.

We are thinking especially of our colleagues from the MMC in Surat and their families, our partners and customers in India.

Please stay safe!

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.