News

Oct 1, 2020

Laser Machining Center LCS 305 in 360 degrees

The Laser MicroJet system with full 5-axis capability can process complex three-dimensional geometries.

Applications include for example the machining of industrial diamond employed in toolmaking as well as superalloys and various composite materials (CMC, CFRP) used in aerospace.

The LCS 305 integrates advanced sensor technology to improve process control (automatic jet angle correction, automatic jet positioning, laser power meter, breakthrough sensor etc.).

Watch the video and learn more about the high-precision LCS 305 in 3D.

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.