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Nov 11, 2019

Laser MicroJet 3D animation

Synova‘s Laser MicroJet: Shaping the future

“Synova has reinvented laser technology and paved the way to new laser applications. Laser MicroJet solves a number of issues causing imperfections in traditional cutting methods due to its unique technology, which combines a water jet with light…”

Click to learn about the working principle, benefits and application areas of this “wet” laser technology.

LDS (Laser Dicing Systems)

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

Details page

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.