The LCS 50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet^® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.  

The LCS 305 with 5 axes is specifically designed for the automatic production of larger and multi-tooth diamond cutting tools. The CNC machine with five synchronous axes is characterized by a particularly intelligent machine concept and highly dynamic axes for maximum precision and speed.

The LCS 150 is a versatile laser cutting system conceived for micro-machining applications, such as cutting, drilling or grooving for a variety of industrial sectors. Different laser sources are available for this machine, allowing up to 200 W. 

The 3-axis LCS 303 is a highly accurate and reliable laser cutting system. It can process a wide variety of materials, from metals to ultra-hard and brittle materials such as diamond or ceramic, to complex composites. Applications include high precision machining of watch components, medical devices and tools, electronic and other high-tech parts.

The 3-axis laser cutting machine LCS 800 with integrated Laser MicroJet® technology is a robust and versatile system conceived for a multitude of high-precision cutting and drilling applications in different industrial sectors. The large mounting table allows machining of virtually any part size and is suited for small series and prototypes but also for large volumes.

The DCS 50 is Synova’s most compact diamond machining system. The 3-axis machine is designed for cutting pointers (0.1 to 1.5 cts.). The DCS 50 with two additional rotary axes also allows high-precision coning, blocking and fancy shaping. 

"DaVinci Diamond Factory" is an automated laser cutting and shaping system for diamonds. Rough diamonds can be transformed into brilliant cut diamonds with up to 57 facets in a single process. The DaVinci system also allows fancy shaping. 

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds. 

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. 

The DCS 30 is Synova’s entry-level model and most compact diamond cutting system. The 2-axis machine is designed for high-precision sawing of pointers and small diamonds up to 2 carats.

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

The Laser MicroJet^® Integration Package (LMJ-iP) principally consists of three main components; the laser source, the water pump containing the water treatment, and the optical head with camera, supplied for customer integration.

The XLS Laser Cutting System integrates Synova’s state-of-the-art Laser MicroJet® (LMJ) technology with a wide machine platform and table for large work pieces. The 5-axis XLS 1005 with optional C2 rotary axis allows high-precision 2D and 3D machining of metals and ceramics, free of heat affected zone (HAZ) and burrs.