News

Dec 2, 2022

The Synergie of Water and Light - New Synova Company Video

As a laser technology and engineering company, we have been developing innovative machining solutions based on our water jet guided laser process for over 25 years.

Our goal is to meet the high quality and precision demands of our customers, whether in the aerospace, semiconductor or jewelry industries and no matter how demanding the machining tasks may be.

We focus on continuous innovation and we trust in the synergy of water and light. And you?

Discover more about what drives us in our new company video!


"Water and light are such powerful forces. Both can be strong and gentle. Precise and all-encompassing. The most impressive elements in the world. And sometimes even frightening.

What if we could use water to tame the force of light and create groundbreaking new technologies that literally shape the world of high-tech, health, aerospace and jewelry?

Synova began with this idea, and it continues to inspire us, every day. We are pioneers in the field of laser technology and the inventors of the water jet guided laser. By combining the elements of water and light, we have created a revolutionary cutting technology, the Laser MicroJet. This cool and clean method, with its unique cylindrical laser beam, provides state-of-the-art, award-winning solutions for cutting, drilling and milling without thermal damage or particle buildup, and with constantly parallel kerfs.

We’ve delivered hundreds of advanced laser machining systems, designed for applications like drilling cooling holes in turbine blades, faceting rough diamond stones and processing wear parts for semiconductor equipment. From the most delicate ceramics to the hardest materials found on earth, our high precision machines are shaping the Diamond, Semiconductor and Metal Industries of today and tomorrow.

We've been perfecting this technology since the mid-90s when we founded our headquarters in Switzerland. Today, we employ over 120 people, including 40 engineers who focus on researching new laser machining solutions.

This continual innovation allows us to tailor our versatile and precise Laser MicroJet systems to solve even the most intricate machining tasks. Isn’t the fusion of water and light amazing?

But that’s not all. To put our customers first we employ a global network of Micro-machining centers. From here we visit our clients regularly to ensure proper maintenance and maximum system efficiency. Additional online customer service offers fast troubleshooting and support worldwide. With subsidiaries in North America, Europe, Africa, the Middle East and Asia, our water jet guided lasers flow to all corners of the world.

From jet engines to wristwatches: you can rely on our water jet guided laser technology to shape your products to your vision.

We trust in the synergy of water and light. And you?

Synova. Your partner for cutting-edge laser machining solutions."

 

LCS (Laser Cutting Systems)

LCS 50

LCS 50

The LCS 50 with 3 or 5 axes is Synova’s most compact and cost-efficient Laser MicroJet® machine. The LCS 50 is ideal for finish-machining of diamond tools, watch components and other small work pieces that require precision cutting, drilling, grooving or slicing as well as 3D processing.  

LCS 305

LCS 305

The LCS 305 with 5 axes is specifically designed for the automatic production of larger and multi-tooth diamond cutting tools. The CNC machine with five synchronous axes is characterized by a particularly intelligent machine concept and highly dynamic axes for maximum precision and speed.

LCS 150

LCS 150

The LCS 150 is a versatile laser cutting system conceived for micro-machining applications, such as cutting, drilling or grooving for a variety of industrial sectors. Different laser sources are available for this machine, allowing up to 200 W. 

LCS 303

LCS 303

The 3-axis LCS 303 is a highly accurate and reliable laser cutting system. It can process a wide variety of materials, from metals to ultra-hard and brittle materials such as diamond or ceramic, to complex composites. Applications include high precision machining of watch components, medical devices and tools, electronic and other high-tech parts.

LCS 800

LCS 800

The 3-axis laser cutting machine LCS 800 with integrated Laser MicroJet® technology is a robust and versatile system conceived for a multitude of high-precision cutting and drilling applications in different industrial sectors. The large mounting table allows machining of virtually any part size and is suited for small series and prototypes but also for large volumes.

DCS (Diamond Cutting Systems)

DCS 50

DCS 50

The DCS 50 is Synova’s most compact diamond machining system. The 3-axis machine is designed for cutting pointers (0.1 to 1.5 cts.). The DCS 50 with two additional rotary axes also allows high-precision coning, blocking and fancy shaping. 

DaVinci Diamond Factory

DaVinci Diamond Factory

"DaVinci Diamond Factory" is an automated laser cutting and shaping system for diamonds. Rough diamonds can be transformed into brilliant cut diamonds with up to 57 facets in a single process. The DaVinci system also allows fancy shaping. 

DCS 150

DCS 150

The DCS 150 is Synova’s diamond cutting system for small and medium-sized natural and laboratory grown diamonds. The 3-axis machine allows sawing rough diamonds with a size of 2 grz. to 4 cts. and coring and slicing of CVD diamonds. 

DCS 300

DCS 300

This diamond cutting system with a working area of 300 x 300 mm is particularly well suited for cutting larger diamonds having a size of 5 carats or more. It offers sawing and pie sawing capabilities for natural diamonds and coring and slicing of CVD diamonds. 

DCS 30

DCS 30

The DCS 30 is Synova’s entry-level model and most compact diamond cutting system. The 2-axis machine is designed for high-precision sawing of pointers and small diamonds up to 2 carats.

LDS (Laser Dicing Systems)

LDS 300 M

LDS 300 M

The Laser Dicing System is primarily designed for semiconductor back-end processing; mainly wafer dicing and scribing applications. The LDS 300 M requires manual loading. Wafer alignment and kerf check are performed automatically. Synova’s new 300 mm (12”) wafer dicing system integrates a maintenance free fiber laser.

LDGS 300 A

LDGS 300 A

The LDGS 300A is a fully automatic laser dicing and edge grinding system. It is suitable for dicing, edge-grinding, drilling and slotting of wafers. It provides excellent capabilities for the removal of micro-cracks on the wafer edge, improving at the same time the fracture strength.

LMJ-iP (Laser MicroJet Integration Package)

Integration Modules

Besides offering complete turnkey systems, Synova also provides the core components of the Laser MicroJet® machines, allowing manufacturing companies to integrate the modules directly into their own machine or production lines.

LMJ-iP

LMJ-iP

The Laser MicroJet® Integration Package (LMJ-iP) principally consists of three main components; the laser source, the water pump containing the water treatment, and the optical head with camera, supplied for customer integration.

XLS (XL Laser Cutting Systems)

XLS 1005

XLS 1005

The XLS Laser Cutting System integrates Synova’s state-of-the-art Laser MicroJet® (LMJ) technology with a wide machine platform and table for large work pieces. The 5-axis XLS 1005 with optional C2 rotary axis allows high-precision 2D and 3D machining of metals and ceramics, free of heat affected zone (HAZ) and burrs.

Are you interested in a demo or feasibility test?

Call now +41 21 55 22 600

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Industrial Applications

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